Quick Easy Tips for Avoiding Mistakes in PCB Enclosure Design
Enclosure Material: Choosing materials with the appropriate thermal conductivity is vital. For instance, aluminum enclosures with a thermal conductivity of approximately 205 W/mK are commonly used for automotive designs to improve heat dissipation.
Component Placement: Components that generate significant heat (e.g., power transistors) should be placed away from sensitive components and preferably near ventilation slots or heat sinks.
Cooling Mechanisms: In some cases, integrating passive cooling elements like thermal pads or heat sinks with a thermal resistance of 0.5°C/W or lower can make a huge difference in maintaining the thermal performance of the design.
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