Are power integrity analysis effective for flexible PCB: Let’s Find Out!
Power Integrity Analysis A flexible printed circuit, commonly referred to as a flex circuit, comprises a layer of metallic traces, typically copper, that is adhered to a dielectric layer, often polyimide. The thickness of the metallic layer can range from very thin (<0.0001″) to very thick (>0.010″), while the dielectric layer thickness can vary between […]
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